{"id":26574,"date":"2022-12-29T21:03:10","date_gmt":"2022-12-29T21:03:10","guid":{"rendered":"https:\/\/mailinvest.blog\/index.php\/2022\/12\/29\/tsmc-ramps-up-3nm-chip-production-in-taiwan-the-register\/"},"modified":"2022-12-29T21:03:10","modified_gmt":"2022-12-29T21:03:10","slug":"tsmc-ramps-up-3nm-chip-production-in-taiwan-the-register","status":"publish","type":"post","link":"https:\/\/mailinvest.blog\/index.php\/2022\/12\/29\/tsmc-ramps-up-3nm-chip-production-in-taiwan-the-register\/","title":{"rendered":"TSMC ramps up 3nm chip production in Taiwan \u2022 The Register"},"content":{"rendered":"

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Mass production of 3nm components has begun at TSMC’s south Taiwan facilities, the silicon slinger announced on Thursday.<\/p>\n

The design is expected to deliver significant performance and efficiency improvements over TSMC’s 5nm node, now widely deployed in Apple, Qualcomm and AMD products. The foundry operator claims its N3 process will offer 60 to 70 percent higher logic density, 15 percent higher performance, while consuming 30 to 35 percent less power than its N5 process.<\/p>\n

It’s worth noting that TSMC is drawing comparisons to its N5 process, which is getting on in age, having been deployed in products for more than two years now. Several chipmakers, including Apple and Nvidia have already begun transitioning production over to TSMC’s N4 node.<\/p>\n

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