{"id":10690,"date":"2022-02-07T19:55:15","date_gmt":"2022-02-07T19:55:15","guid":{"rendered":"https:\/\/mailinvest.blog\/index.php\/2022\/02\/07\/intel-joins-risc-v-international-pledges-1bn-to-chip-biz-the-register\/"},"modified":"2022-02-07T19:55:15","modified_gmt":"2022-02-07T19:55:15","slug":"intel-joins-risc-v-international-pledges-1bn-to-chip-biz-the-register","status":"publish","type":"post","link":"https:\/\/mailinvest.blog\/index.php\/2022\/02\/07\/intel-joins-risc-v-international-pledges-1bn-to-chip-biz-the-register\/","title":{"rendered":"Intel joins RISC-V International, pledges $1bn to chip biz \u2022 The Register"},"content":{"rendered":"

<\/a>\n<\/p>\n

\n

Intel is establishing a $1bn fund to support early-stage and established chip companies to develop innovative chip and packaging technologies.<\/p>\n

The semiconductor giant is also opening its doors to companies who also need help with design and validation of advanced chips on all major architectures, including x86, Arm, and RISC-V. A goal of the fund is to advance the concept of 3D chiplet design for tighter integration of different types of processor cores.<\/p>\n

For example, some chip designs are combining beefy Arm CPU cores with RISC-V management CPU cores, or want to include multiple dies made using different process nodes in a single package. Intel’s factories are advancing into nodes that will support tight packaging of those chips.<\/p>\n

\n